Re: Excellent idea from AMD

Subject: Re: Excellent idea from AMD
Name: ludicrous
Date: 10/16/2001 3:50:19 PM (GMT-7)
IP Address: 138.67.74.229
In Reply to: Re: Excellent idea from AMD posted by Dan Druff
Message:

If reduction of thermal capacitance is the reason for using the hollow design, then filling up the hollow with a heat-conductive compound reduces the efficiency for which the design was modified in the first place.

If, on the other hand, you can get a "heat pipe" effect by filling the hollow with a high-counductivity substance, then you will get benefits.