Re: Excellent idea from AMD


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Subject: Re: Excellent idea from AMD
Name: Dan Druff
Date: 10/15/2001 6:07:27 PM (GMT-7)
IP Address: 208.181.26.131
In Reply to: Re: Excellent idea from AMD posted by LED
Message:

Hollow heatsink is slightly better than solid according to the comparison. So why not fill up the hollow with arctic silver thermal interface material so double if not triple heat dissipation even more. I think it makes a lot of sense. The
hollow Thermoengine heatsink is even better because it is sitting right on top of the CPU.
Thanks for the additional information, LED.

Dan Druff

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