Name: Dan Druff Date: 10/15/2001 6:07:27 PM (GMT-7) IP Address: 208.181.26.131 In Reply to: Re: Excellent idea from AMD posted by LED Message:
Hollow heatsink is slightly better than solid according to the comparison. So why not fill up the hollow with arctic silver thermal interface material so double if not triple heat dissipation even more. I think it makes a lot of sense. The |
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