Re: PPGA or FC-PGA

Differences Between FC-PGA and PPGA Form Factors

The FC-PGA package is used on Pentium® III processors, and is referred to as the Flip Chip Pin Grid Array package. The PPGA package is used on Intel® Celeron™ processors, and is referred to as the Plastic Pin Grid Array package.

The PPGA package used on the Intel® Celeron™ processors has the actual silicon core facing down towards the motherboard. The silicon core is covered by a heat slug helping to dissipate heat from the core. The heat slug transfers heat from the core to the heatsink. As processors get smaller and faster, the ability to dissipate heat from the processor core is become more and more critical. The FC-PGA package, flips the silicon core over facing up. The core sits on top of the actual package and is exposed. The silicon die is exposed and makes direct contact with the heatsink.